The effect of an underfill's coefficient of thermal expansion and Young's modulus on flip chips during thermal cycling at Celestical Inc. Toronto, Ontario

Arsenault, Paul J.2023-06-072023-06-071998https://unbscholar.lib.unb.ca/handle/1882/30062en-CAhttp://purl.org/coar/access_right/c_16ecThe effect of an underfill's coefficient of thermal expansion and Young's modulus on flip chips during thermal cycling at Celestical Inc. Toronto, Ontariosenior reportJ., BonhamEngineering