The effect of underfill geometry on the fatigue strength of a flip-chip at Celestica, Inc. Toronto, Ontario

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dc.contributor.advisorJ., Bonham
dc.contributor.authorCarpenter, Kristopher L.
dc.date.accessioned2023-06-07T19:06:24Z
dc.date.available2023-06-07T19:06:24Z
dc.date.issued1999
dc.description.copyrightNot available for use outside of the University of New Brunswick
dc.description.noteCarpenter, Kristopher L (1999). The effect of underfill geometry on the fatigue strength of a flip-chip at Celestica, Inc. Toronto, Ontario. (Engineering Senior Report no. TM-904 1999). Fredericton : University of New Brunswick, Dept. of Mechanical Engineering TM-904 1999 1882/16740
dc.identifier.urihttps://unbscholar.lib.unb.ca/handle/1882/32787
dc.language.isoen_CA
dc.publisherUniversity of New Brunswick
dc.rightshttp://purl.org/coar/access_right/c_16ec
dc.subject.disciplineEngineering
dc.titleThe effect of underfill geometry on the fatigue strength of a flip-chip at Celestica, Inc. Toronto, Ontario
dc.typesenior report
thesis.degree.disciplineEngineering
thesis.degree.fullnameBachelor of Science in Engineering
thesis.degree.grantorUniversity of New Brunswick
thesis.degree.levelundergraduate
thesis.degree.nameBachelor of Science in Engineering

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