The effect of an underfill's coefficient of thermal expansion and Young's modulus on flip chips during thermal cycling at Celestical Inc. Toronto, Ontario

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dc.contributor.advisorJ., Bonham
dc.contributor.authorArsenault, Paul J.
dc.date.accessioned2023-06-07T17:30:00Z
dc.date.available2023-06-07T17:30:00Z
dc.date.issued1998
dc.description.copyrightNot available for use outside of the University of New Brunswick
dc.description.noteArsenault, Paul J (1998). The effect of an underfill's coefficient of thermal expansion and Young's modulus on flip chips during thermal cycling at Celestical Inc. Toronto, Ontario . (Engineering Senior Report no. TM-884 1998). Fredericton : University of New Brunswick, Dept. of Mechanical Engineering TM-884 1998 1882/14775
dc.identifier.urihttps://unbscholar.lib.unb.ca/handle/1882/30062
dc.language.isoen_CA
dc.publisherUniversity of New Brunswick
dc.rightshttp://purl.org/coar/access_right/c_16ec
dc.subject.disciplineEngineering
dc.titleThe effect of an underfill's coefficient of thermal expansion and Young's modulus on flip chips during thermal cycling at Celestical Inc. Toronto, Ontario
dc.typesenior report
thesis.degree.disciplineEngineering
thesis.degree.fullnameBachelor of Science in Engineering
thesis.degree.grantorUniversity of New Brunswick
thesis.degree.levelundergraduate
thesis.degree.nameBachelor of Science in Engineering

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